Useful Links and Resources

A curated list of external resources related to packaging benchmarks, signal integrity, and power integrity.

SI/PI-Database – Institut für Theoretische Elektrotechnik

A collection of printed circuit board (PCB) based structures representing various electromagnetic aspects for signal integrity and power integrity applications. Designed to aid the development of machine learning tools and techniques.

Visit Database

The IEEE EPS Packaging Benchmark Suite

F. Guo, A. Yilmaz, et al. “The IEEE EPS Packaging Benchmark Suite” IEEE EPEPS Conference, Oct. 2021.

View on IEEE Xplore

IEEE EPEPS 2023 Packaging Benchmark Tutorial – Slides

Download the comprehensive presentation slides regarding advanced packaging tools for benchmarks from the IEEE EPEPS conference.

Download Slides (.zip)