Packaging Benchmark Suite

SI/PI-Database – Institut für Theoretische Elektrotechnik : this database is a collection of printed circuit board (PCB) based structures which represent different electromagnetic aspects for signal integrity and power integrity applications. It is intended to help the development of machine learning tools and techniques for signal integrity, power integrity and electromagnetic compatibility applications
The IEEE EPS Packaging Benchmark Suite | IEEE Conference Publication | IEEE Xplore : F. Guo, A. Yilmaz, et al. “The IEEE EPS Packaging Benchmark Suite” IEEE EPEPS Conference, Oct. 2021.
IEEE EPEPS 2023 Packaging Benchmark Tutorial – Slides

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