Packaging Benchmark Suite

The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages. As a result of advances in computer hardware/software infrastructure and computational electromagnetics, today, a large (and expanding) set of methods can be used to evaluate the electromagnetic performance of electronic packages. Indeed, a variety of commercial, freeware, and academic simulation tools are commonly used in electrical packaging.

Publicly available verification, validation, and performance benchmarks like the IEEE EPS TC-EDMS Packaging Benchmark suite can

• help systematically combat the problem of the ubiquity of error
• inform the public as well as researchers and practitioners in the field about open problems and the state of the art solution methods
• lower barriers to entry for new researchers/methods
• reduce importance of subjective factors when judging simulation methods
• increase the credibility of the results obtained and claims made by computational scientists and engineers
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