The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical
Committee
on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about
electromagnetic, electrical and circuit modeling and simulation problems encountered and the
computational methods used when designing, analyzing, and developing electronic packages. As a
result of advances in computer hardware/software infrastructure and computational
electromagnetics,
today, a large (and expanding) set of methods can be used to evaluate the electromagnetic
performance of electronic packages. Indeed, a variety of commercial, freeware, and academic
simulation tools are commonly used in electrical packaging.
Publicly available verification, validation, and performance benchmarks like the IEEE EPS TC-EDMS
Packaging Benchmark suite can
- help systematically combat the problem of the ubiquity of error
- inform the public as well as researchers and practitioners in the field about open
problems and the state of the art solution methods
- lower barriers to entry for new researchers/methods
- reduce importance of subjective factors when judging simulation methods
- increase the credibility of the results obtained and claims made by computational
scientists and engineers
- Read more...
