About the Packaging Benchmark Suite
The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages. As a result of advances in computer hardware/software infrastructure and computational electromagnetics, today, a large (and expanding) set of methods can be used to evaluate the electromagnetic performance of electronic packages. Indeed, a variety of commercial, freeware, and academic simulation tools are commonly used in electrical packaging.
Why the Benchmark Suite?
- Systematically combat the problem of the ubiquity of error
- Inform the public, researchers, and practitioners about open problems and state-of-the-art solutions
- Lower barriers to entry for new researchers/methods
- Reduce importance of subjective factors when judging simulation methods
- Increase the credibility of results obtained and claims made by computational scientists and engineers
Recent Benchmark Problems
VI. mmWave Filter
mmWave Package Substrate Band Pass Filter Simulation and Characterization Benchmark Problem
V. Power Integrity Via Field Impedance Challenge
Via Field Coupling and Crosstalk Characterization for Power Integrity Benchmark Problem
IV. PCB Laminate Parameter Extraction for Simulation
PCB Laminate Parameter Extraction for Simulation Benchmark Problem
Have a Benchmark to Share?
Contribute to the advancement of electronic packaging by submitting your standardized modeling challenges to the suite.
All submissions undergo a formal peer-review process.