Packaging Benchmark Suite

The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages. As a result of advances in computer hardware/software infrastructure and computational electromagnetics, today, a large (and expanding) set of methods can be used to evaluate the electromagnetic performance of electronic packages. Indeed, a variety of commercial, freeware, and academic simulation tools are commonly used in electrical packaging.

Publicly available verification, validation, and performance benchmarks like the IEEE EPS TC-EDMS Packaging Benchmark suite can